Eutectic bonding machines are core equipment for high-reliability packaging. Through eutectic bonding technology, they achieve high-precision, high-reliability metallurgical connections between chips (such as lasers, power amplifiers, etc.) and substrates, lead frames, or other carriers, securing the chips to the substrate or housing with high precision and strength. This equipment primarily serves high-end applications with extremely high requirements for heat dissipation, hermeticity, and electrical performance. Its core value lies in solving four major challenges—heat dissipation, conductivity, fixation, and hermeticity—in one step through metal bonding.

　　Technical Specifications:

　　· Placement accuracy: ±5μm;

　　· Movement speed: 1m/s;

　　· Acceleration/deceleration: 1G~2G;

　　· Pressurization accuracy: Target pressure 10g~200g, ±1g;

　　Target pressure 200g~1000g, ±20g;

　　Target pressure 1000g~7500g, ±100g;

　　· Pressure fluctuation: ≤2%. Application Scenarios

　　Eutectic bonding machines are core process equipment in the high-end semiconductor packaging field, focusing on electronic device manufacturing scenarios with extreme requirements for performance, reliability, and operating environment, such as semiconductor packaging, optical communication, and laser device processing. This equipment helps chips and carriers achieve a robust, efficient, and stable connection, forming a low thermal resistance, high conductivity metal bonding interface through eutectic bonding. Googol Technology's solution uses the GVN series high-performance multi-axis network motion controller + GSHD series high-performance servo driver + GSFD series low-voltage servo driver. This solution is interconnected through Googol's proprietary gLink-II gigabit ring network communication bus, enabling high-speed, high-precision signal transmission.

　　Both the GSHD and GSFD servo drivers support gantry dual-drive control algorithms. Combined with Googol's self-developed high-performance control algorithm, along with precise trajectory planning and a unique vibration suppression algorithm, they ensure that the equipment maintains extremely high positioning accuracy and operational stability even at high speeds. Both servo drivers are equipped with rapid force control functionality; the controller can trigger force control at any position. The servo drivers are only responsible for the two core stages of detection and pressure holding; the remaining position planning is handled by the controller. During the detection phase, the servo drive approaches the object surface at a constant speed. Once the pressure holding condition is met, it immediately switches to the pressure holding phase. A pressure sensor is connected to the drive, and closed-loop regulation ensures pressure accuracy. After the pressure holding period, the servo drive locks to its current position to ensure pressure stability. Furthermore, the entire process can also be controlled by a controller, allowing for greater freedom of movement. The servo drive's rapid force control function automatically matches the most suitable pressure control range based on the size, weight, and process requirements of different chips, achieving a pressure control accuracy of ≤±2% for target pressure fluctuation. This rapid force control function ensures precise and controllable pressure during chip mounting, effectively preventing chip damage from excessive pressure or poor mounting due to insufficient pressure. This provides reliable assurance for product quality. The integrated solution of GVN motion controller + GSHD servo drive + GSFD servo drive, combined with the independently developed gLink-II gigabit ring network bus, and intelligent algorithms such as gantry dual-drive control, rapid force control, and vibration suppression, achieves a breakthrough improvement in high-speed, high-precision, and high-stability motion control and precise pressure control for the eutectic converter. This solution not only facilitates the domestic substitution of eutectic reactors but also provides strong technical support for the semiconductor packaging, optical communication, and other industries to develop towards higher integration and higher reliability, thanks to its excellent dynamic performance and process adaptability.

　　Founded in 1999 by three internationally renowned scholars and experts in robotics, microelectronics, and motion control from the Hong Kong University of Science and Technology—Li Zexiang, Gao Bingqiang, and Wu Hong—Googol Technology is the first high-tech enterprise in the Asia-Pacific region with independent intellectual property rights, specializing in the research and development of core technologies in motion control and intelligent manufacturing. It is one of the leading providers of comprehensive intelligent manufacturing solutions both domestically and internationally. Googol Technology focuses on core technology research in five areas: motion control, servo drives, multi-dimensional sensing, industrial field networks, and industrial software. Through in-depth domestic and international cooperation, industry-academia-research collaboration, and actively cultivating system integrators, Googol Technology's motion control technologies and products are widely applied in industrial control fields such as microelectronics, robotics, CNC machine tools, electronic processing, testing, printing, packaging, and production automation.
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